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Location: Home > Research > Research Divisions > SiP Center

System Packaging and Integration Technology Center
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Overview 

The vision of the center is to establish a national R&D platform for advanced packaging and system integration operating as independent business entity. The center provides key technologies and total solutions for IC industry, and promotes the innovation capability and competitiveness of IC packaging industry in China. 

Research 

♦ System in package (SiP) design 

Wafer level packaging 

Advanced substrate technologies 

Micro assembly 

Reliability and failure analysis 

Optoelectronic interconnect and integration. 

 

X-ray Image of WLCSP Product 

 

12 inch Silicon Interposer with High Density TSV 

 

Via-last TSV Packaging of Fingerprint Sensor 

 

System in Package on Organic Substrate (Before Molding) 

 

Heterogeneous Integration of High Power Chips on Composite Substrate 

 

Design and Simulation of Hybrid PackageFC and WB Stacking 

 

Eye Diagram of 4x14Gbps QSFP Active Optical Cable 

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