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New Technology to Improve the Reliability of RRAM
RRAM has the advantages of simple structure, high speed, low power consumption and easy 3D integration. It is considered as one of the most promising candidates for the next generation of high-density non-vo...
IMECAS and SMIC Cooperate on MEMS R&D and Foundry Platform
According to the agreement , IMECAS and SMIC will work together closely to take advantage of IMECAS ’ s experiences in MEMS Sensor design , packaging technology design , SMIC ’ s standardized process techn...
Researchers Developed Ultra-Low-Power Chip in IMECAS
Recently, researchers in the Institute of Microelectronics of Chinese Academy of Sciences (IMECAS) apply near / sub threshold technique to chip manufacturing. Meanwhile, intelligent power / clock management ...
SMO in 14 nm CMOS Production Validated by Wafer Data in IMECAS
Source-mask optimization (SMO) is an essential resolution enhancement technology in 14 nm and below nodes. Aiming at design rules for a particular layer, mask structure, property and structure of photoresist...
7th International Conference on Computer Aided Design for Thin-Film Transistor Technologies (CAD-TFT 2016)had been successfully held
Institute of Microelectronics of the Chinses Academy of Sciences ( IMECAS ) organized the 7th International Conference on Computer Aided Design for Thin-Film Transistor Technologies ( CAD-TFT.Delivered a tal...
Research Divisions MORE>>
Key Laboratory of Microelectronic Devices Integrated Technology, CAS
Key Laboratory of Silicon Device Technology, CAS
Integrated Circuit Advanced Process Center
System Packaging and Integration Technology Center
Three Dimensional Memory Technology Center
Communication and Information Engineering Center
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