Institute of Microelectronics, Chinese Academy of Sciences (IME) developed the first China-made package for Loongson CPU in July, 2010.
The package is another milestone for IME following its well-performed package for switching chips of multi-CPUs. It also marks the beginning of an era when China can fully provide its own packages for advanced CPU chips.
Loongson CPU, the first China-made CPU, is provided with WB-BGA package and its clock frequency is 800MHz. The package has over 800 bonding wires with pitch being only 60 microns. Its power dissipation is more than 20W.
The package follows the cavity-down cascade WB-BGA Structure. With outstanding thermal management, the structure has been widely adopted internationally to package advanced chips. This is its first application in China due to its complicated packaging process.
The package for Loongson CPU was completed within only two months by IME who was highly praised by its users.