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On July 9th, 2011, under the support of 02 National Science and Technology Major Projects and the Packaging/Testing Alliance of China, the first Through-Silicon-Via (TSV) Consortium in China was established by the Institute of Microelectronics of Chinese Academy of Sciences (IMECAS). YU Xiekang, the secretary of the alliance, YE Tianchun, the Director of IMECAS, and representatives from over 30 companies, universities, and research institutes attended the launch meeting.
In their addresses at the meeting, Mr. Yu gave recommendations regarding the Consortium’s operation and division of responsibilities. Mr. Ye expressed his hopes for the consortium. He believed that the consortium is a promising step towards integrating academia and industrial research, and that through the collaboration and sharing of resources, the consortium can help to promote the growth and development of the packaging/testing industry in China. Prof. of IMECAS, WAN Lixi and YU Daquan, introduced general information about the TSV consortium and Stage I project plan respectively. The meeting also invited a specialist from the National Science Library of Chinese Academy of Sciences (NSLC), who summarized patent distribution and current research status of TSV technology.
Representatives from industry, academia, and research institutes all contributed to the discussion regarding the establishment of the consortium as well as its research content. Many industry representatives expressed strong interested in joining the consortium, and believed that the TSV consortium is an excellent platform that will allow companies to gain better understanding of the technical requirements more efficiently at a substantially lower cost, as well as providing a way of evaluating and testing their own techniques and products. After in-depth discussion, the attendees reached the agreement that the Stage I projects should focus on investigating the technical feasibility and cost assessment. The final result should include not only a product prototype, but also a complete technical scheme report in order to provide references for future technical selection.
After the discussions, over 10 companies signed formal agreements to participate in the Stage I Projects of TSV Consortium.
Fig.1. Scene Photo for signing ceremony (Image by IMECAS)
RESEARCHER CONTACT:
Researcher WAN Lixi
Institute of Microelectronics of Chinese Academy of Sciences
E-mail: lixiwan@ime.ac.cn
Website of Dept.:
http://english.ime.cas.cn/Research/ResearchDivisions/LAB9/
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