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The Core Communication Chip in IoT Technology Developed Successfully in IMECAS
Author: Dept.6 LIANG Xiaoxin, Translate by WANG Fang
Update time: 2011-11-18
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Recently, the Department of Electronics System Technology (Dept. No.6) in the Institute of Microelectronics of Chinese Academy of Sciences (IMECAS) made significant breakthroughs in key technology of low-power consumption sensor networks core chip and SoC (System on a Chip). Two types (low-power consumption & high performance) of wireless sensor networks core chip and its SoC products self-developed by the cooperant research group led by Dept. No.6 had passed networking test in early November, 2011. Being the core communication chip in the Internet of Things (IoT) technology, it can provide chip support for the low-power consumption sensor network equipments and industrialization.

The project is special topic research in the project of New generation broadband wireless mobile communication network, one of the major national science and technology projects. The system-in-package (SiP) technology was used in the chip, which integrated 780MHz Radio Frequency (RF) circuit, baseband circuit, analog-to-digital converter (ADC), digital -to- analog converter (DAC), low-power consumption sensor Interface, micropoint control unit (MCU), static random access memory (SRAM), Flash and so on. The performance of this chip is similar to those of overseas advanced product under the same power consumption, and the chip Integration is in leading position in domestic market. The success in the project gave an impetus to the application of wireless sensor network (WSN) networking protocol with self-owned intellectual property rights and promoted the development of national new generation broadband wireless mobile communication network. 

Image by IMECAS


Researcher YAN Yuepeng
Institute of Microelectronics of Chinese Academy of Sciences
E-mail: yanyuepeng@ime.ac.cn
Website of Dept.:

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