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Multi-Fields-Coupled Bonding System First Successfully Developed in China by IMECAS Researchers
Author: Dept.8 LI Nan, Translate by WANG Fang
Update time: 2012-02-07
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In January 16, research in Multi-Fields-Coupled Bonding System, which is one of the Equipment Projects of Chinese Academy of Sciences (CAS), passed acceptance test successfully. Experts from the Planning and Financial Division of CAS agreed that it is the first bonding system driven by multi- fields with fully independent intellectual property right, whose original and special self-adaptive pressure distribution adjust structure has been successfully applied to the hermetic package, LED (Light Emitting Diode) bonding package and other research fields. The research group in the Microelectronic Equipment Technology Department (Dept. No.8) of Institute of Microelectronics of the Chinese Academy of Sciences (IMECAS) realizes a brand-new innovative kind of macroscopic quantity preparation method on large-size and high-quality graphene, which is of great science significance and application value.

This bonding system was driven by multi-field coupling driving mode (electric field, temperature field and pressure field). It can accomplish anodic bonding, adhesive bonding, eutectic bonding, etc. Compared with existing bonding machine's rigid pressure structure, this system is more adaptive to the non-planarity, various thicknesses between pressure heads and heterogeneous films materials, avoiding material breakage during bonding process, which can improve fabrication uniformity and increase yield.

The development of this bonding system enlarges technical reserves for the China Next Generation Integrated Circuit (IC) Key Equipment having self-owned intellectual property.

Multi-Fields-Coupled Bonding System (Image by IMECAS)


Experts Inspected the Equipment(Image by IMECAS)

Researcher LI Chaobo
Institute of Microelectronics of Chinese Academy of Sciences
E-mail: lichaobo@ime.ac.cn
Website of Dept.:

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