NAME:WAN Lixi doctoral tutor
Title:Professor
Major: Electronic PackagingTechnology
E-mail: lixiwan@ime.ac.cn

RESEARCH INTERESTS:
Electronics Packaging Technology, High Density Integration Electronics, EMC, Microwave and Antenna Technology
EDUCATION:
1982 Xidian University, B.S. degree
1986 Southwest Jiaotong University, M.S. degree
1991 Beijing University of Post and Telecommunications , Ph.D degree

PROFESSIONAL EXPERIENCE:
1982-1983 Guilin University of electronic Technology, Teaching Assistant
1986-1989 Southwest Jiaotong University, Lecturer
1991-1993 Tsinghua University, postdoctoral Fellow
1993-1997 Beijing University of Post and Telecommunications, Professor
1997-1998 City University of Hong Kong, ResearchFellow
1998-2000 University of Illinois at Urbana-Champaign, visiting associate professor
2000-2006 The Georgia Institute of Technology, scientist/engineer II

PUBLICATION:
Over 110 papers published internationally and at home
PROJECTS AND TOPICS PARTICIPATED:
863 project "key Techniques of Optical Interconnects for Chip-to-Chip Communication at High Density/Speed” Principal Investigator
863 project "High Speed Optical Interconnection technology and Its Testing Platform" Deputy principal Investigator
National Key Program project “Key Technology of High Density Package, 3D-Package and SiP”, Principal Investigator

PATENTS:
Over 20 awarded and pending patents

AWARDS:
1. Outstanding Contribution Award in 2005 ECTC international conference
2. Best Paper Award in 2005 ICPET international conference
3. Second Award of IEEE periodical IEEE Transaction ( 2004 )
4. Outstanding Technical Paper Award in 2004 EPTC international conference
5. Youth Scientist Award of URSI
6. The Government Special Allowance of The State Council of China
7. Several excellent paper awards at home