Name: LIU Fengman       

Gender:Male

Title:Nationality        China

Education:Ph.D.        

E-Mail:  liufengman@ime.ac.cn

Department:Packaging and integration center

Address:3 Beitucheng West Road, Chaoyang District, Beijing, PR China        Postcode        100029

Tel:+86-10-82995675

Education Background:

2015.5 – 2016.5        Visiting Scholar in National University of Singapore

2006.9 – 2009.6        Ph.D in Microelectronics and solid state electronics

Institute of Semiconductors, Chinese Academy of Sciences

2004.9 – 2006.6        M.S.        in Optoelectronics science and technology

Huazhong University of Science and Technology

2000.9 – 2006.6        B.S.        in Optoelectronics science and technology

Huazhong University of Science and Technology

Professional Experience:

2009.7-2011.9 Institute of Microelectronics, CAS assistant researcher

2011.10 until now Institute of Microelectronics, CAS associate researcher

Research Interests:

High speed optical transceiver and module

RF and ROF(Radio over Fiber) packaging

Publications:

 Fengman Liu, Binbin Yang，et al., A Surface Mounting Embedded Optical Transceiver with Bi-directional Data Rate of 8 Channels × 10Gbps, Fiber and Integrated Optics, 2014, 33（1-2）: 17-25

Yi He, Fengman Liu, et al., Design and implementation of a 700–2600 MHz RF SiP module for micro base station, Microsystem Technology, 2014, 20：2295-2300

Yi He, Fengman Liu，et al., Design and Implementation of Two Different RF SiP for Micro Base Station, 2014 IEEE 16th Electronics Packaging Technology Conference, EPTC 2014, 2014.12.3-2014.12.5

Huimin He，Fengman Liu, et al., Research on Optical Transmitter and Receiver Module Used for High-Speed Interconnection between CPU and Memory, Fiber and Integrated Optics, 2016

Peng Wu，Fengman Liu, et al., Design and implementation of a rigid-flex RF front-end system-in-package. Microsystem Technology, 2016

Honour:

Excellent employee of IMECAS

First prize of May 4 young scholar consortium

Patents Application:

More than 20 patents

Projects and Subjects Participated:

1. " Key technologies research on broadband three-dimensional optoelectronic integration" (Funded by NSFC)

2. " Design and development of RF multichip 3D package " (Funded by 03 major projects )

3. "Radio frequency SiP thermal management and reliability analysis" (Funded by 02 major projects)

4. Some Project from HUAWEI and other enterprises projects