Name:WANG Yinghui         
Gender:Female
Title:Professor        
Nationality:P.R.China
Education:Ph.D        
E-Mail:wangyinghui@ime.ac.cn
Department:Smart Sensing Center
Address:3 Beitucheng West Road, Chaoyang District, Beijing, PR China        
Postcode:100029

Education Background:
1994.9～1998.7        Bachelor, Harbin Institute of Technology, Material Science and Engineering
2002.4～2003.3        Research Student, The University of Tokyo, Department of Precision Engineering
2003.4～2005.3        Master, The University of Tokyo, Department of Precision Engineering
2005.4～2008.3        Doctor, The University of Tokyo, Department of Precision Engineering

Professional Experience:
1998.10～2001.1        Speedy-tech Electronics (Shenzhen) Ltd., Research & Development Department, Engineer
2001.1～2002.3        Jingliang Electronics (Shenzhen) Ltd., Reliability & Analysis Department, Engineer
2008.4～2008.8        The University of Tokyo, Department of Precision Engineering, Project Researcher
2008.9～2010.11         The University of Tokyo, Department of Precision Engineering, JSPS Postdoctoral Researcher
2010.12～2011.3         National Institute for Materials Science (Japan) , Postdoctoral Researcher
2011.4～2015.3         The University of Tokyo, Project Researcher
2015.1～ Institute of Microelectronics of Chinese Academy of Sciences, Professor
Research Interests:
MEMS Vacuum Sealing, Microelectronics Integration, Wafer Bonding
Publications:
1.        Ying-Hui Wang, Matiar R Howlader, Kenji Nishida, Takashi Kimura, and Tadatomo Suga, “Study on Sn-Ag Oxidation and Feasibility of Room Temperature Bonding of Sn-Ag-Cu Solder”, Materials Transactions, Vol.46, No.11 (2005) pp.2431-2436.
2.        Ying-Hui Wang, Matthias Hutter, and Tadatomo Suga, “Bonding Behaviors of Au-Au and Au-Sn Thin Bumps at Low Temperature”, Proceedings of the 7th International Conference on Electronics Packaging Technology (ICEPT2006), Shanghai, China, Aug. 26-Aug. 29, 2006, pp. 118-122.
3.        Ying-Hui Wang, Kenji Nishida, Matthias Hutter, Takashi Kimura, and Tadatomo Suga, “Low-Temperature Process of Fine-Pitch Au–Sn Bump Bonding in Ambient Air”, Japanese Journal of Applied Physics, Vol.46 (2007) Part 1, No.4B., pp.1961-1967.
4.        Ying-Hui Wang, Takahiro Sato, Tsuyoshi Sugiura, and Tadatomo Suga, “Low-Temperature Bumpless Bonding for SAW Components”, Japanese Journal of Applied Physics, Vol.47, No.4 (2008) 2521-2525.
5.        Ying-Hui Wang and Tadatomo Suga, “Effect of Surface Contamination on Solid-State Bondability of Sn-Ag-Cu Bumps in Ambient Air”, Materials Transactions, Vol.49, No.7 (2008) 1508-1512.
6.        Ying-Hui Wang and Tadatomo Suga, “20-?m-Pitch Au Micro-bump Interconnection at Room Temperature in Ambient Air”, the 58th Electronic Components and Technology Conference (ECTC2008), Florida, USA, May 27- May 30, 2008, pp. 944-949.
7.        Ying-Hui Wang and Tadatomo Suga, “The Chip-on-Board Bonding Using Non-Conductive Film and Metallic Bumps by the Surface Activated Bonding Method”, IEEE 9th VLSI Packaging Workshop in Japan (VPWJ2008), The Westin Miyako Kyoto, Kyoto, Japan, Dec. 1-2, 2008, pp. 91-94.
8.        Shingo Taniyama, Ying-Hui Wang, Masahisa Fujino and Tadatomo Suga, “Room Temperature Wafer Bonding Using Surface Activated Bonding Method”, IEEE 9th VLSI Packaging Workshop in Japan (VPWJ2008), The Westin Miyako Kyoto, Kyoto, Japan, Dec. 1-2, 2008, pp. 141-144.
9.        Chenxi Wang, Shingo Taniyama, Ying-Hui Wang, and Tadatomo Suga, “High-Precision Alignment for Low Temperature Wafer Bonding”, Journal of Electrochemical Society, Vol.156, No.3 (2009) H197-201.
10.        Ying-Hui Wang, Jian Lu and Tadatomo Suga, “Low-temperature Wafer Bonding Using Gold Layers”, International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), Beijing, China, Aug. 10-13, 2009, pp.516-519.
11.        Ryuji Kurayama, Eiji Higurashi, Yinghui Wang, Tadatomo Suga, Yasuo Doi, Yoshihiro Sawayama and Iwao Hosako, “Low Temperature Bonding of Ge for Infrared Detectors”, 2nd International IEEE Workshop on Low Temperature Bonding for 3D Integration, The University of Tokyo, Hongo, Tokyo, Japan, Jan. 19-20, 2010, pp.451-455.
12.        Keigo Oshikawa, Ying-Hui Wang and Tadatomo Suga, “Low Temperature Bonding of Si Wafers in Nitrogen Atmosphere”, International Conference on Electronics Packaging (ICEP2010), Sapporo Convention Center, Hokkaido, Japan, May 12-14, 2010, pp.23-26.
13.        Ying-Hui Wang and Tadatomo Suga, “Influence of Bonding Atmosphere on Low-Temperature Wafer Bonding”, the 60th Electronic Components and Technology Conference (ECTC2010), Las Vegas, USA, June 1-4, 2010, pp.435-439.
14.        Keisuke Goto, Masahisa Fujino, Yinghui Wang and Tadatomo Suga, “Reduction of Non-uniformity in Stress Distribution on the Bonded Interface Caused by Solid State Bonding”, Proceedings of ECO-MATES 2011, Osaka, Japan, Nov. 28-30, 2011, pp.173-175.
15.        Yinghui Wang and Kun’ichi Miyazawa, “Influence of UV Irradiation on Polymerization of LLIP-Prepared C60 Nanowhiskers”, Extended Abstracts, The 40th Commemorative Fullerenes-Nanotubes General Symposium, Nagoya, Japan, Mar. 8-10, 2011.
16.        Eiji Higurashi, Ryuji Kurayama, Yinghui Wang, Tadatomo Suga, Yoshihiro Sawayama, Yasuo Doi, and Iwao Hosako, “Room-Temperature Direct Bonding of Ge Wafers for Application to Far-infrared Detectors”, The 28th SENSOR SYMPOSIUM on Sensors, Micromachines and Application Systems, Tokyo Japan, Sept. 26-27, 2011, C4-5.
17.        Yasutaka Eida, Zhang Wenjing, Masahisa Fujino, Yinghui Wang, Ming Li and Tadatomo Suga, “Low temperature bonding on electroless plated surfaces with nano-structure”, 27th Japan Institute of Electronics Packaging Conference (JIEP), Sendai, Japan, Mar. 13-15, 2013, 13E-04.
18.        Ying-Hui Wang and Tadatomo Suga, “Influence of Diffusion on Solid-state Bonding for Micro-bumps at Low Temperatures”, IEEE CPMT Symposium Japan 2013 (ICSJ 2013), Kyoto University, Kyoto, Japan, Nov. 11-13, 2013, 15-3.
19.        Ran He, Masahisa Fujino, Akira Yamauchi, Yinghui Wang and Tadatomo Suga, “Combined Surface Activated Bonding Technique for Low-Temperature Cu/Dielectric Hybrid Bonding”, ECS Journal of Solid State Science and Technology, 5 (7) P419-P424 (2016).
20.        W. Xu, S. K. Wang, Y. Xu, Y. H. Wang, D. P. Chen, H. G. Liu, A new wafer bonding method based on spot pressing technique, Trans. Chin. Welding Inst.. 37, 9, 125 (2016).
Honour:
2015, Chinese Academy of Sciences Program
2011，The 28th Sensor Symposium, Best Technical Paper Award
2009，International Conference on Electronic Packaging Technology & High Density Packaging, ASE Group CPMT Best Paper Award
2008，IEEE 9th VLSI Packaging Workshop in Japan, Young Award
Patents Application:
N.A.