80+ journal and conference papers (32 First Author), H-index=15,Total citation=821 (Source: Google Scholar 2020-07)
1. S.-K. Wang*, Q. Huang, J. Zhao, Y. Zhou, X. L. Zhao, P. L. Yao, X. Y. Liu, X. L. Liang, Electro-chemiresistive Functionalization of SWCNT-TFT by PCz and Its "Electronic Hourglass" Application with Zero-static Power Consumption, ACS Applied Energy Materials, 2,11(2019) 8253.
2. S.-K. Wang, B. Sun, M.-M. Cao, H.-D. Chang, Y.-Y. Su, H.-O. Li, and H.-G. Liu*, "Modification of Al2O3/InP interfaces using sulfur and nitrogen passivations," J. Appl. Phys., 121 (2017) 184104.
3. S. K. Wang*, M. Cao, B. Sun, H. Li, H. G. Liu, "Reducing the interface trap density in Al2O3/InP stacks by low-temperature thermal process", Appl. Phys. Express 8, 091201 (2015).
4. S. K. Wang, H.-G. Liu*, and A. Toriumi, "Kinetic Study of GeO Disproportionation into GeO2/Ge System Using X-ray Photoelectron Spectroscopy", Appl. Phys. Lett. 101, 5 (2012)
5. S. K. Wang*, K. Kita, C. H. Lee, T. Tabata, T. Nishimura, K. Nagashio, and A. Toriumi, "Desorption kinetics of GeO from GeO2/Ge structure", J. Appl. Phys. 108, 054104 (2010).
6. X. Y. Liu*, J. L. Hao, N. N. You, Y. Bai, Y. D. Tang, C. Y. Yang, S. K. Wang*, High mobility SiC MOSFET with low Dit using high pressure microwave plasma oxidation, Chin. Phys. B, 29 (2020) 037301.
7. Y. Xu, S. K. Wang*, P. L. Yao, Y. H. Wang, D. P. Chen, An air-plasma enhanced low-temperature wafer bonding method using high-concentration water glass adhesive layer, Appl. Surf. Sci. 500 (2019) 144007.
8. X. Y. Liu*, J. L. Hao, N. N. You, Y. Bai, S. K. Wang*, High pressure microwave plasma oxidation of 4H-SiC with low interface trap density, AIP Advances, 9 (2019) 125150.
9. Z. Y. Peng, S. K. Wang*, Y. Bai, Y. D. Tang, X. M. Chen, C. Z. Li, K. A. Liu, X. Y. Liu*,“High Temperature 1MHz Capacitance-Voltage Method for Evaluation of Border Traps in 4H-SiC MOS System”, J. Appl. Phys. 123 (2018) 135302.
10. X. Yang, S. K. Wang*, X. Zhang, B. Sun, W. Zhao, H. D. Chang, Z. H. Zeng, H. G. Liu*,“Al2O3/GeOx gate stack on germanium substrate fabricated by in situ cycling ozone oxidation method”, Appl. Phys. Lett. 105 (2014) 092101.
11. S. K. Wang, "Germanium and III-Vs for future logic (Invited)", Compound Semiconductor International 2017, Brussels Belgium, (March 7-8, 2017)
12. S. K. Wang, "Rapid Growth of SiO2 on SiC with Low Dit using High Pressure Microwave Oxygen Plasma (Invited)", 13th IEEE International Conference on ASIC, Chongqing, China, (Oct 9-Nov 1, 2019)
13. S. K. Wang,"Interfaces in Ge MOSFETs (invited)", 8th National Functional Materials and Application Conference,Harbin, China, (Aug.24-26, 2013).
14. S. K. Wang, Q. Huang, J. Zhao, X. Zhao, Y. Zhou, X. Liu, X. Liang*, Hysteretic Single Walled Carbon Nanotube Thin Film Transistor for Ultralow Static Power Consumption Application, 50th International Conference on Solid State Devices and Materials, Tokyo, Japan, (Sep. 8-12, 2018).
15. S. K. Wang, X. Yang, Z. J. Gong, B. Sun, W. Zhao, H. D. Chang, H. G. Liu, "Si-substrate-based High Mobility Ge-pMOSFETs Using Ozone Passivated Al2O3/GeOx Gate Dielectric", International Conference on Solid State Devices and Materials 2014, Fukuoka, Japan, (Sep.25-29, 2014). |