Name

Xie Jing

Gender

Female

Title

Associate professor

Nationality

Chinese

Education

Degree: PhD

E-Mail

xiejing@ime.ac.cn

Department

Microelectronic Instrument and Equipment Center

Address

3 Beitucheng West Road, Chaoyang District, Beijing, PR China

Postcode

100029

Tel

86-10-82995789

Fax

010-82995758

Education Background

2002.9 - 2006.7: Tsinghua University, Electronic Engineering,

2006.9 - 2011.7: Institute of Semiconductors, Chinese Academy of Sciences., Microelectronics and Solid State Electronics, Ph.D.

Professional Experience

2011.7 - 2014.12, Assistant Researcher, Institute of Microelectronics, Chinese Academy of Sciences

2014.12 - Present, Associate professor, Institute of Microelectronics, Chinese Academy of Sciences

2015.9 - Present, Professor, University of Chinese Academy of Sciences

Publications

[1].Zhang Yang, Dou Wei, Luo Wei, Lu Weier,Xie Jing*, Li Chaobo and Xia Yang, Large area graphene produced via the assistance of surface modification[J]. Journal of Semiconductors, 2013, 34(7):47-51.

[2].Wei Luo,Jing Xie, Chaobo Li, Yang Zhang, and Yang Xia, High-precision thickness regulation of graphene layers with low energy helium plasma implantation.[J]. Nanotechnology, 2012, 23(37):1-6.

[3].Wei Luo,Jing Xie, Yang Zhang, Chaobo Li and Yang Xia, Anodic bonding using a hybrid electrode with a two-step bonding process[J]. Journal of semiconductors, 2012, 33(6): 066001.

[4].Yunfei Liu,Jing Xie, Hui Zhao, Wei Luo, Jinling Yang, Ji An and Fuhua Yang, An effective approach for restraining electrochemical corrosion of polycrystalline silicon caused by an HF-based solution and its application for mass production of MEMS devices[J]. Journal of Micromechanics and Microengineering, 2012, 22(3): 035003.

[5].Jing Xie, Yunfei Liu, Mingliang Zhang, Jinling Yang, and Fuhua Yang, A simple method for effectively restrain electrochemical corrosion of polycrystalline silicon by HF-based solutions[C]. Micro Electro Mechanical Systems (MEMS), 2011 IEEE 24th International Conference on. IEEE, 2011: 205-208.

[6].Jing Xie, Yunfei Liu, Hui Zhao, Jinling Yang, and Fuhua Yang, Reliable low-cost fabrication and characterization methods for micromechanical disk resonators[C]. 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference. IEEE, 2011: 2462-2465.

[7].Jing Xie, Yunfei Liu, Jinling Yang, Longjuan Tang, and Fuhua Yang, Stress and resistivity controls on in situ boron doped LPCVD polysilicon films for high-Q MEMS applications[J]. Journal of Semiconductors, 2009, 30(8):34-38.

[8].Yunfei Liu,Jing Xie, Mingliang Zhang, Jinling Yang, and Fuhua Yang, An effective approach for restraining galvanic corrosion of polycrystalline silicon by hydrofluoric-acid-based solutions[J]. journal of Microelectromechanical systems, 2011, 20(2): 460-465.

[9].Yunfei Liu,Jing Xie, Jinling Yang, Longjuan Tang, and Fuhua Yang, Liu Y, Xie J, Yang J, et al. In-situ boron-doped low-stress LPCVD polysilicon for micromechanical disk resonator[C]. Solid-State and Integrated-Circuit Technology, 2008. ICSICT 2008. 9th International Conference on. IEEE, 2008: 2387-2390.

[10].         Longjuan Tang, Yinfang Zhu, Jinling Yang, Yan Li, Wei Zhou,Jing Xie, Yunfei Liu and Fuhua Yang, Dependence of wet etch rate on deposition, annealing conditions and etchants for PECVD silicon nitride film[J]. Journal of Semiconductors, 2009, 30(9): 096005.

[11].         Lu, W., Dong, Y., Li, C., Xia, Y., Liu, B., &Xie, J., et al. Preparation of ZnO films with variable electric field-assisted atomic layer deposition technique[J]. Applied Surface Science, 2014, 303(6):111–117.

Research Interests  

Research on MEMS manufacturing technology, Micro-nano materials and structure, and related equipment.

Projects and Subjects Participated

National Key Research and Development Project of China (micro-biochemical), Instrument Developing Project of the CAS Team (SPM), and Instrument Developing Project of the CAS (Spectrometer). As the chief designer of the research and development of Instrument and Equipment Development Project (2D materials and devices) and The project of manufacturing technology and complete sets of technology for very large scale integrated circuits (ALD).

Patents Application

20 authorized patents

Honour  

Special Award of the Education and Teaching Achievement Award of the Chinese Academy of Sciences